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Tianjin Baienwei New Material Technology Co.,Ltd

Products >> electronic packaging housings & lids

electronic packaging housings & lids

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Description
Product Name: electronic packaging housings & lids
Supply Ability:
Related proudcts hermetic seals, electronic packages,
Specifications as per customers' requirements
Price Term:
Port of loading:
Minimum Order
Unit Price:

Housings
Modules
Carriers
Guidebars
Lids,covers,caps
PCBs baseplates
Heat sinks and heat spreaders
Terminal pins

Materials:Silicon Aluminum Alloys(AlSi Alloys)

Configuration:Platforms,Plug-ins,Flatpacks,TO Headers etc.

Advantages:
Low CTE,adjustable;
Low density;
High thermal conductivity;
high electrical conductivity(excellent EMI/RF shielding performance);
High stiffness;
Good thermo-mechanical stability;
Hermeticity;
Machinability,platability and co***tible with microelectronic assembly technology.

Contact Us
Company: Tianjin Baienwei New Material Technology Co.,Ltd
Contact: Ms. zhang ivy
Address: No. 13, Baofu Road, Energy Conservation & Environmental Protection Industrial District
Postcode: 301800
Tel: 862229291825
Fax: 86-022-29291821
E-mail:         


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Tel : 862229291825 Fax : 86-022-29291821
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